T. Y. Lee

9 papers and 754 indexed citations i.

T. Y. Lee has authored 9 papers that have received a total of 754 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Molecular Biology. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers). T. Y. Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in United States, Italy and Finland. T. Y. Lee's co-authors include D. R. Frear, K. N. Tu, K. N. Tu, K. N. Tu and Licínio M. Gando‐Ferreira and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Biomacromolecules