Tama Fouzder
About
Tama Fouzder has authored 14 papers that have received a total of 373 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 1 paper in Molecular Biology. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (6 papers). Tama Fouzder is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (6 papers) and collaborates with scholars based in Bangladesh, Hong Kong and Pakistan. Tama Fouzder's co-authors include Y.C. Chan, K.C. Yung, Asit Kumar Gain, Ahmed Sharif and Daniel K. Chan and has published in prestigious journals such as Journal of Alloys and Compounds, IEEE Access and Microelectronics Reliability
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