Tao Hang
About
Tao Hang has authored 122 papers that have received a total of 2.0k indexed citations.
This includes 98 papers in Electrical and Electronic Engineering, 41 papers in Electronic, Optical and Magnetic Materials and 37 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), Electrodeposition and Electroless Coatings (30 papers) and 3D IC and TSV technologies (24 papers). Tao Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), Electrodeposition and Electroless Coatings (30 papers) and 3D IC and TSV technologies (24 papers) and collaborates with scholars based in China, United States and Japan. Tao Hang's co-authors include Anmin Hu, Huiqin Ling, Yunwen Wu and Ming Li and has published in prestigious journals such as Advanced Materials, Langmuir and Chemical Communications
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