Teck Joo Goh

7 papers and 418 indexed citations i.

Teck Joo Goh has authored 7 papers that have received a total of 418 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Heat Transfer and Optimization (3 papers). Teck Joo Goh is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Heat Transfer and Optimization (3 papers) and collaborates with scholars based in Malaysia, United States and China. Teck Joo Goh's co-authors include Z.A. Zainal, K. N. Seetharamu, G.A. Quadir, Ishak Abdul Azid and K.N. Seetharamu and has published in prestigious journals such as Thermochimica Acta, Journal of Electronic Packaging and Microelectronics International