Tengfei Jiang

26 papers and 443 indexed citations i.

Tengfei Jiang has authored 26 papers that have received a total of 443 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (15 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers). Tengfei Jiang is often cited by papers focused on 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (15 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers) and collaborates with scholars based in United States, China and Taiwan. Tengfei Jiang's co-authors include Paul S. Ho, Rui Huang, Jay Im, Nobumichi Tamura and Chenglin Wu and has published in prestigious journals such as Applied Physics Letters, Scripta Materialia and Materials.