Tetsuo KUMAZAWA

26 papers and 267 indexed citations i.

Tetsuo KUMAZAWA has authored 26 papers that have received a total of 267 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Metallurgy and Material Forming (4 papers) and 3D IC and TSV technologies (3 papers). Tetsuo KUMAZAWA is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Metallurgy and Material Forming (4 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in Japan, United States and China. Tetsuo KUMAZAWA's co-authors include Masaharu Kitano, Esteban P. Busso, John R. Barry, A. Nishimura and Hideo Miura and has published in prestigious journals such as Applied Physics Letters, Macromolecules and International Journal for Numerical Methods in Engineering.