T.H. Low

4 papers and 292 indexed citations i.

T.H. Low has authored 4 papers that have received a total of 292 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Aerospace Engineering. The topics of these papers are 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Aluminum Alloy Microstructure Properties (1 paper). T.H. Low is often cited by papers focused on 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Aluminum Alloy Microstructure Properties (1 paper) and collaborates with scholars based in Singapore. T.H. Low's co-authors include J.H.L. Pang, B.S. Xiong, Desmond Y. R. Chong, K. H. Prakash and Luhua Xu and has published in prestigious journals such as Thin Solid Films and IEEE Transactions on Components and Packaging Technologies