Tielin Shi
About
Tielin Shi has authored 17 papers that have received a total of 307 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 5 papers in Mechanics of Materials and 4 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and Engineering Diagnostics and Reliability (2 papers). Tielin Shi is often cited by papers focused on 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and Engineering Diagnostics and Reliability (2 papers) and collaborates with scholars based in China, United States and South Korea. Tielin Shi's co-authors include Guanglan Liao, Zi‐Rong Tang, Lei Su, Zirong Tang and Jie Liu and has published in prestigious journals such as Journal of Controlled Release, Applied Surface Science and Journal of Non-Crystalline Solids
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