Vadim Gektin

8 papers and 189 indexed citations i.

Vadim Gektin has authored 8 papers that have received a total of 189 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 1 paper in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers) and Heat Transfer and Boiling Studies (2 papers). Vadim Gektin is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers) and Heat Transfer and Boiling Studies (2 papers) and collaborates with scholars based in United States, United Kingdom and Ireland. Vadim Gektin's co-authors include Avram Bar‐Cohen, Husam A. Alissa, Gamal Refai-Ahmed, Bahgat Sammakia and Tahir Cader and has published in prestigious journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Circuits and Devices Magazine