Vesa Vuorinen
About
Vesa Vuorinen has authored 79 papers that have received a total of 2.6k indexed citations.
This includes 66 papers in Electrical and Electronic Engineering, 47 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (58 papers), 3D IC and TSV technologies (39 papers) and Intermetallics and Advanced Alloy Properties (30 papers). Vesa Vuorinen is often cited by papers focused on Electronic Packaging and Soldering Technologies (58 papers), 3D IC and TSV technologies (39 papers) and Intermetallics and Advanced Alloy Properties (30 papers) and collaborates with scholars based in Finland, India and Germany. Vesa Vuorinen's co-authors include Tomi Laurila, J.K. Kivilahti, Mervi Paulasto‐Kröckel, Aloke Paul and Toni T. Mattila and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Joan M. Stevenson are about Top fields papers by Thibaut Divoux are about Top authors papers by Chia‐Chen Chen are co-authored with Top fields papers by Ruoli Bai are about Top fields papers by J.I. Montero are about Top journals papers by Adrian Burgess are published in Top journals papers by M. T. Jackson are published in Top countries impacted by papers by Andrew Lac