Vesa Vuorinen
About
Vesa Vuorinen has authored 79 papers that have received a total of 2.6k indexed citations.
This includes 66 papers in Electrical and Electronic Engineering, 47 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (58 papers), 3D IC and TSV technologies (39 papers) and Intermetallics and Advanced Alloy Properties (30 papers). Vesa Vuorinen is often cited by papers focused on Electronic Packaging and Soldering Technologies (58 papers), 3D IC and TSV technologies (39 papers) and Intermetallics and Advanced Alloy Properties (30 papers) and collaborates with scholars based in Finland, India and Germany. Vesa Vuorinen's co-authors include Tomi Laurila, J.K. Kivilahti, Mervi Paulasto‐Kröckel, Aloke Paul and Toni T. Mattila and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
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