W. Heinz
About
W. Heinz has authored 20 papers that have received a total of 423 indexed citations.
This includes 11 papers in Mechanics of Materials, 10 papers in Electrical and Electronic Engineering and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers). W. Heinz is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Germany, Austria and United Kingdom. W. Heinz's co-authors include Gerhard Dehm, Bernhard Völker, Megan J. Cordill, Thomas Detzel and Kurt Matoy and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Thin Solid Films
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Nikolay Kochev Top countries impacted by papers by Jessie Abraham Top journals papers by Vijaya Shukla are published in Top fields papers by Erik Helander are about Top authors papers by Peter D. Hodkinson are co-authored with Top fields papers by Zengbing Liu are about Top authors papers by Gregory L. Weber are co-authored with Top authors papers by V. Ya. Levchenko are co-authored with