W. Heinz
About
W. Heinz has authored 20 papers that have received a total of 423 indexed citations.
This includes 11 papers in Mechanics of Materials, 10 papers in Electrical and Electronic Engineering and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers). W. Heinz is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Germany, Austria and United Kingdom. W. Heinz's co-authors include Gerhard Dehm, Bernhard Völker, Megan J. Cordill, Thomas Detzel and Kurt Matoy and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Thin Solid Films
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