W. Heinz
About
W. Heinz has authored 20 papers that have received a total of 423 indexed citations.
This includes 11 papers in Mechanics of Materials, 10 papers in Electrical and Electronic Engineering and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers). W. Heinz is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Metal and Thin Film Mechanics (9 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Germany, Austria and United Kingdom. W. Heinz's co-authors include Gerhard Dehm, Bernhard Völker, Megan J. Cordill, Thomas Detzel and Kurt Matoy and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Thin Solid Films
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Kyle Kleinbeck are published in Top fields papers by Naresh Chandrasekaran are about Top fields papers by Michelle Pine are about Top countries impacted by papers by Steven J. Walker Top journals papers by Hirotaka Nakashima are published in Top countries impacted by papers by Sheikh Irfanullah Khan Top fields papers by Dongmei Bai are about Top authors papers by Rachel Byrne are co-authored with