W. Steinhögl
About
W. Steinhögl has authored 23 papers that have received a total of 1.4k indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 9 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (4 papers). W. Steinhögl is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in Germany, Austria and France. W. Steinhögl's co-authors include M. Engelhardt, G. Schindler, G. Steinlesberger, E. Hulpke and M. Traving and has published in prestigious journals such as Physical Review Letters, The Journal of Chemical Physics and Journal of Applied Physics
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