Wei-Kai Liou
About
Wei-Kai Liou has authored 22 papers that have received a total of 304 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 6 papers in Human-Computer Interaction. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Virtual Reality Applications and Impacts (5 papers) and 3D IC and TSV technologies (5 papers). Wei-Kai Liou is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Virtual Reality Applications and Impacts (5 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in Taiwan, China and India. Wei-Kai Liou's co-authors include Yee‐Wen Yen, Kaushal Kumar Bhagat, Chun‐Yen Chang, Chiapyng Lee and Chao-Ming Chen and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of materials research/Pratt's guide to venture capital sources and Materials Chemistry and Physics
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