Wei-Yu Chen
About
Wei-Yu Chen has authored 15 papers that have received a total of 355 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Metal and Thin Film Mechanics (3 papers). Wei-Yu Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Metal and Thin Film Mechanics (3 papers) and collaborates with scholars based in Taiwan and China. Wei-Yu Chen's co-authors include Jenq‐Gong Duh, Shih-Kang Tien, Wei Tu, Kin‐Lu Wong and Min‐Hang Weng and has published in prestigious journals such as Electrochimica Acta, IEEE Transactions on Antennas and Propagation and Surface and Coatings Technology
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