Wenhua Yang
About
Wenhua Yang has authored 21 papers that have received a total of 363 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 5 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Copper Interconnects and Reliability (5 papers). Wenhua Yang is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in China, Japan and Hong Kong. Wenhua Yang's co-authors include Tadatomo Suga, Chunyan Wu, Zhixiang Huang, Wei Ji and Xiang Yin and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Energy
In The Last Decade
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