Wen-Wei Shen
About
Wen-Wei Shen has authored 15 papers that have received a total of 260 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and High voltage insulation and dielectric phenomena (4 papers). Wen-Wei Shen is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and High voltage insulation and dielectric phenomena (4 papers) and collaborates with scholars based in Taiwan, China and United States. Wen-Wei Shen's co-authors include Junbo Deng, Kuan‐Neng Chen, Guanjun Zhang, Wei‐Chung Lo and Alvin Kai-Xing Lee and has published in prestigious journals such as Journal of Applied Physics, Biological and Pharmaceutical Bulletin and IEEE Transactions on Plasma Science
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