Xiaopeng Xu
About
Xiaopeng Xu has authored 21 papers that have received a total of 162 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). Xiaopeng Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers) and collaborates with scholars based in United States, Switzerland and Belgium. Xiaopeng Xu's co-authors include Victor Moroz, Aditya P. Karmarkar, Pirkko Pfäffli, Wei Guo and Geert Van der Plas and has published in prestigious journals such as International Journal of Plasticity, IEEE Electron Device Letters and Microelectronics Reliability
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