Xiaowu Zhang

154 papers and 3.0k indexed citations i.

About

Xiaowu Zhang has authored 154 papers that have received a total of 3.0k indexed citations. This includes 81 papers in Electrical and Electronic Engineering, 45 papers in Mechanical Engineering and 18 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (57 papers) and Heat Transfer and Optimization (22 papers). Xiaowu Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (57 papers) and Heat Transfer and Optimization (22 papers) and collaborates with scholars based in Singapore, China and United States. Xiaowu Zhang's co-authors include Boon Long Lau, Yong Han, Fa Xing, John H. Lau and D. Pinjala and has published in prestigious journals such as Science, Journal of Biological Chemistry and Advanced Materials.

In The Last Decade

Fields of papers published by Xiaowu Zhang

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Xiaowu Zhang

Since Specialization
Citations
Rankless by CCL
2025