Yasumitsu Orii

28 papers and 171 indexed citations i.

Yasumitsu Orii has authored 28 papers that have received a total of 171 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 5 papers in Automotive Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Yasumitsu Orii is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers) and collaborates with scholars based in Japan, United States and Taiwan. Yasumitsu Orii's co-authors include Hiroyuki Mori, Sayuri Kohara, Katsuyuki Sakuma, K. Matsumoto and Keiji Matsumoto and has published in prestigious journals such as Acta Materialia, Journal of Micromechanics and Microengineering and Microelectronics Reliability