Yaw S. Obeng
About
Yaw S. Obeng has authored 84 papers that have received a total of 2.4k indexed citations.
This includes 59 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 25 papers in Biomedical Engineering. The topics of these papers are Copper Interconnects and Reliability (24 papers), 3D IC and TSV technologies (18 papers) and Electronic Packaging and Soldering Technologies (17 papers). Yaw S. Obeng is often cited by papers focused on Copper Interconnects and Reliability (24 papers), 3D IC and TSV technologies (18 papers) and Electronic Packaging and Soldering Technologies (17 papers) and collaborates with scholars based in United States, Germany and France. Yaw S. Obeng's co-authors include Chukwudi Okoro, Kathleen Richardson, Allen J. Bard, Michael T. Postek and Lyle E. Levine and has published in prestigious journals such as Journal of the American Chemical Society, ACS Nano and Journal of Applied Physics
In The Last Decade
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