Yee‐Wen Yen
About
Yee‐Wen Yen has authored 93 papers that have received a total of 1.1k indexed citations.
This includes 74 papers in Electrical and Electronic Engineering, 64 papers in Mechanical Engineering and 17 papers in General Materials Science. The topics of these papers are Electronic Packaging and Soldering Technologies (67 papers), Intermetallics and Advanced Alloy Properties (38 papers) and 3D IC and TSV technologies (29 papers). Yee‐Wen Yen is often cited by papers focused on Electronic Packaging and Soldering Technologies (67 papers), Intermetallics and Advanced Alloy Properties (38 papers) and 3D IC and TSV technologies (29 papers) and collaborates with scholars based in Taiwan, Philippines and United States. Yee‐Wen Yen's co-authors include Chiapyng Lee, Wei-Kai Liou, Chih‐Ming Chen, Yu‐Lin Kuo and Sinn-wen Chen and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Colloid and Interface Science
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