Yi-Hsin Pao
About
Yi-Hsin Pao has authored 15 papers that have received a total of 217 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 9 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Fatigue and fracture mechanics (6 papers) and Aluminum Alloys Composites Properties (3 papers). Yi-Hsin Pao is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Fatigue and fracture mechanics (6 papers) and Aluminum Alloys Composites Properties (3 papers) and collaborates with scholars based in United States, Singapore and Hong Kong. Yi-Hsin Pao's co-authors include Tsung‐Yu Pan, R. K. Govila, Sheng Liu, Xiaowu Zhang and Peter A. Engel and has published in prestigious journals such as Journal of Electronic Materials, Journal of Adhesion Science and Technology and Journal of Electronic Packaging
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