Yi-Sa Huang
About
Yi-Sa Huang has authored 8 papers that have received a total of 617 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (5 papers) and Surface and Thin Film Phenomena (2 papers). Yi-Sa Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (5 papers) and Surface and Thin Film Phenomena (2 papers) and collaborates with scholars based in Taiwan and United States. Yi-Sa Huang's co-authors include Chih Chen, Chien-Min Liu, K. N. Tu, Han-wen Lin and Hsiang‐Yao Hsiao and has published in prestigious journals such as Science, Scientific Reports and Scripta Materialia
In The Last Decade
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