Yi‐Shao Lai
About
Yi‐Shao Lai has authored 119 papers that have received a total of 2.0k indexed citations.
This includes 107 papers in Electrical and Electronic Engineering, 33 papers in Mechanical Engineering and 29 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (98 papers), 3D IC and TSV technologies (59 papers) and Copper Interconnects and Reliability (19 papers). Yi‐Shao Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (98 papers), 3D IC and TSV technologies (59 papers) and Copper Interconnects and Reliability (19 papers) and collaborates with scholars based in Taiwan, United States and Singapore. Yi‐Shao Lai's co-authors include Chang-Lin Yeh, Ping‐Feng Yang, Ying-Ta Chiu, Tong Hong Wang and Rongsheng Chen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
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