Yiyu Qian

35 papers and 707 indexed citations i.

Yiyu Qian has authored 35 papers that have received a total of 707 indexed citations. This includes 27 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 7 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (9 papers) and Intermetallics and Advanced Alloy Properties (9 papers). Yiyu Qian is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (9 papers) and Intermetallics and Advanced Alloy Properties (9 papers) and collaborates with scholars based in China, Japan and United States. Yiyu Qian's co-authors include Xin Ma, Dušan P. Sekulić, Hongqin Wang and Fengjiang Wang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Dental Research