Yong‐Sung Eom

52 papers and 725 indexed citations i.

Yong‐Sung Eom has authored 52 papers that have received a total of 725 indexed citations. This includes 39 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 13 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (25 papers) and Injection Molding Process and Properties (15 papers). Yong‐Sung Eom is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (25 papers) and Injection Molding Process and Properties (15 papers) and collaborates with scholars based in South Korea, United States and Switzerland. Yong‐Sung Eom's co-authors include Keon‐Soo Jang, Hyun‐Cheol Bae, Kwang‐Seong Choi, Jae‐Do Nam and Jong-Tae Moon and has published in prestigious journals such as ACS Applied Materials & Interfaces, Industrial & Engineering Chemistry Research and Japanese Journal of Applied Physics