Hyun‐Cheol Bae
About
Hyun‐Cheol Bae has authored 36 papers that have received a total of 397 indexed citations.
This includes 28 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 6 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Injection Molding Process and Properties (9 papers). Hyun‐Cheol Bae is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Injection Molding Process and Properties (9 papers) and collaborates with scholars based in South Korea, United States and Italy. Hyun‐Cheol Bae's co-authors include Kwang‐Seong Choi, Yong‐Sung Eom, Keon‐Soo Jang, Haksun Lee and Jin Ho Lee and has published in prestigious journals such as Industrial & Engineering Chemistry Research, Applied Surface Science and Japanese Journal of Applied Physics
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