Haksun Lee
About
Haksun Lee has authored 16 papers that have received a total of 243 indexed citations.
This includes 7 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Injection Molding Process and Properties (5 papers) and 3D IC and TSV technologies (4 papers). Haksun Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Injection Molding Process and Properties (5 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in South Korea, United States and China. Haksun Lee's co-authors include Hyun‐Cheol Bae, Yong‐Sung Eom, Kwang‐Seong Choi, Jin Ho Lee and Jin Ho Lee and has published in prestigious journals such as ACS Applied Materials & Interfaces, IEEE Journal of Emerging and Selected Topics in Power Electronics and IEEE Transactions on Components Packaging and Manufacturing Technology
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