Young-Doo Jeon

10 papers and 193 indexed citations i.

Young-Doo Jeon has authored 10 papers that have received a total of 193 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (2 papers). Young-Doo Jeon is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (2 papers) and collaborates with scholars based in South Korea and Germany. Young-Doo Jeon's co-authors include Kyung‐Wook Paik, H. Reichl, Sanguk Lee, Kyung-Wook Paik and Myung-Jin Yim and has published in prestigious journals such as Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies