YU Sheng-lin
About
YU Sheng-lin has authored 43 papers that have received a total of 700 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 6 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (10 papers). YU Sheng-lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (10 papers) and collaborates with scholars based in China. YU Sheng-lin's co-authors include Songbai Xue, Yan Chen, Lili Gao and Zhong Sheng and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of the Optical Society of America A and Optical Engineering
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