Yu‐Hsiang Hsiao
About
Yu‐Hsiang Hsiao has authored 47 papers that have received a total of 882 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 10 papers in Industrial and Manufacturing Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (8 papers) and Industrial Vision Systems and Defect Detection (7 papers). Yu‐Hsiang Hsiao is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (8 papers) and Industrial Vision Systems and Defect Detection (7 papers) and collaborates with scholars based in Taiwan, United Kingdom and India. Yu‐Hsiang Hsiao's co-authors include Chao‐Ton Su, Mu‐Chen Chen, Cheng‐Yi Liu, How Tseng and Yu‐Chun Chuang and has published in prestigious journals such as Cement and Concrete Research, Journal of Business Research and Trends in Food Science & Technology
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