Yung‐Chi Lin
About
Yung‐Chi Lin has authored 17 papers that have received a total of 301 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 8 papers in Education and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Mathematics Education and Teaching Techniques (7 papers). Yung‐Chi Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Mathematics Education and Teaching Techniques (7 papers) and collaborates with scholars based in Taiwan. Yung‐Chi Lin's co-authors include Jenq‐Gong Duh, Der‐Ching Yang, Shih-Kang Tien, Jey‐Jau Lee and Sien Chi and has published in prestigious journals such as Journal of Alloys and Compounds, Scripta Materialia and Journal of materials research/Pratt's guide to venture capital sources
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