Z. Lai

28 papers and 589 indexed citations i.

Z. Lai has authored 28 papers that have received a total of 589 indexed citations. This includes 19 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 7 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Semiconductor Quantum Structures and Devices (6 papers). Z. Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Semiconductor Quantum Structures and Devices (6 papers) and collaborates with scholars based in Sweden, China and Germany. Z. Lai's co-authors include Anders Larsson, H. Nordén, M. Sadeghi, J. Liu and Shuai Wang and has published in prestigious journals such as Applied Physics Letters, Journal of Colloid and Interface Science and Materials Science and Engineering A