Ze Zhu
About
Ze Zhu has authored 28 papers that have received a total of 341 indexed citations.
This includes 11 papers in Mechanical Engineering, 9 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and Copper Interconnects and Reliability (6 papers). Ze Zhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in China, Hong Kong and Singapore. Ze Zhu's co-authors include Fengshun Wu, Yan‐Cheong Chan, Ying Peng, Luyi Zhu and Yongshuai Xie and has published in prestigious journals such as Chemosphere, Materials Science and Engineering A and Journal of Alloys and Compounds
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