Ze Zhu
About
Ze Zhu has authored 28 papers that have received a total of 341 indexed citations.
This includes 11 papers in Mechanical Engineering, 9 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and Copper Interconnects and Reliability (6 papers). Ze Zhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in China, Hong Kong and Singapore. Ze Zhu's co-authors include Fengshun Wu, Yan‐Cheong Chan, Ying Peng, Luyi Zhu and Yongshuai Xie and has published in prestigious journals such as Chemosphere, Materials Science and Engineering A and Journal of Alloys and Compounds
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Kunihiko Okano are co-authored with Top fields papers by Ricardo Moreira are about Top fields papers by Kazuto Ikemoto are about Top authors papers by Zahra Rashidi are co-authored with Top fields papers by Soon-Chan Hong are about Top countries impacted by papers by Y. Belot Top journals papers by James M. Lewis are published in Top countries impacted by papers by George Irwin