Zhidong Xia
About
Zhidong Xia has authored 71 papers that have received a total of 1.4k indexed citations.
This includes 48 papers in Electrical and Electronic Engineering, 48 papers in Mechanical Engineering and 14 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (46 papers), 3D IC and TSV technologies (24 papers) and Aluminum Alloys Composites Properties (22 papers). Zhidong Xia is often cited by papers focused on Electronic Packaging and Soldering Technologies (46 papers), 3D IC and TSV technologies (24 papers) and Aluminum Alloys Composites Properties (22 papers) and collaborates with scholars based in China, Yemen and United States. Zhidong Xia's co-authors include Yao Shi, Yongping Lei, Fu Guo, Fu Guo and Xiaoyan Li and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Metallurgical and Materials Transactions A
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