Journal of Electronic Packaging
About
The 2.0k papers published in Journal of Electronic Packaging in the last decades have received a total of 27.5k indexed citations.
Papers published in Journal of Electronic Packaging usually cover Electrical and Electronic Engineering (1.2k papers), Mechanical Engineering (1.0k papers) and Mechanics of Materials (515 papers) specifically the topics of Electronic Packaging and Soldering Technologies (887 papers), Heat Transfer and Optimization (494 papers) and 3D IC and TSV technologies (436 papers). The most active scholars publishing in Journal of Electronic Packaging are Yogendra Joshi, John H. Lau, Issam Mudawar, Abhijit Dasgupta and Cemal Basaran.
In The Last Decade
Fields of papers published in Journal of Electronic Packaging
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers published in Journal of Electronic Packaging. Nodes represent fields, and links connect fields that are likely to share authors.
Countries where authors publish in Journal of Electronic Packaging
Since SpecializationTotal citations of papers
This map shows the geographic distribution of research published in Journal of Electronic Packaging. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in Journal of Electronic Packaging with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).
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