Andy Miller
About
Andy Miller has authored 53 papers that have received a total of 503 indexed citations.
This includes 44 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 8 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). Andy Miller is often cited by papers focused on 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers) and collaborates with scholars based in Belgium, United States and The Netherlands. Andy Miller's co-authors include Eric Beyne, Gerald Beyer, Fumihiro Inoue, Lan Peng and Joeri De Vos and has published in prestigious journals such as Bioresource Technology, ACS Catalysis and Environment International
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