Bite Zhou
About
Bite Zhou has authored 15 papers that have received a total of 413 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 6 papers in Aerospace Engineering and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloy Microstructure Properties (6 papers). Bite Zhou is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloy Microstructure Properties (6 papers) and collaborates with scholars based in United States, Hong Kong and Germany. Bite Zhou's co-authors include Thomas R. Bieler, Tae-Kyu Lee, A. Zamiri, Chad M. Parish and Kuo-Chuan Liu and has published in prestigious journals such as Journal of Electronic Materials and IEEE Transactions on Components Packaging and Manufacturing Technology
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