Kuo-Chuan Liu
About
Kuo-Chuan Liu has authored 12 papers that have received a total of 209 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (3 papers). Kuo-Chuan Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (3 papers) and collaborates with scholars based in United States, Taiwan and Hong Kong. Kuo-Chuan Liu's co-authors include Tae-Kyu Lee, Jenq‐Gong Duh, Hongtao Ma, Chi-Yang Yu and J. W. Morris and has published in prestigious journals such as Materials Letters, Journal of Electronic Materials and Journal of Statistical Planning and Inference
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