Hongtao Ma
About
Hongtao Ma has authored 14 papers that have received a total of 635 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 3 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers). Hongtao Ma is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers) and collaborates with scholars based in United States, Hong Kong and China. Hongtao Ma's co-authors include Tae-Kyu Lee, Kuo-Chuan Liu, Masakatsu Kato, Thomas R. Bieler and Hongbo Zeng and has published in prestigious journals such as Journal of Materials Science, Tribology International and Regulatory Peptides
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Vicki A. Montgomery are published in Top authors papers by Mohammad Hasan Aghdaie are co-authored with Top countries impacted by papers by Nils Ståhl Top journals papers by Na Wu are published in Top fields papers by Yasuto Itoyama are about Top fields papers by Hylke M. Blauw are about Top journals papers by D.K. Stammers are published in Top fields papers by Anita Johanna Tørmoen are about