B.S. Xiong

4 papers and 209 indexed citations i.

B.S. Xiong has authored 4 papers that have received a total of 209 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). B.S. Xiong is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in Singapore and United States. B.S. Xiong's co-authors include J.H.L. Pang, Luhua Xu, T.H. Low, Fa Xing and Desmond Y. R. Chong and has published in prestigious journals such as Thin Solid Films, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Advanced Packaging