Byoung‐Joon Kim

34 papers and 651 indexed citations i.

Byoung‐Joon Kim has authored 34 papers that have received a total of 651 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 18 papers in Biomedical Engineering and 9 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), Advanced Sensor and Energy Harvesting Materials (17 papers) and 3D IC and TSV technologies (10 papers). Byoung‐Joon Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), Advanced Sensor and Energy Harvesting Materials (17 papers) and 3D IC and TSV technologies (10 papers) and collaborates with scholars based in South Korea, Germany and United States. Byoung‐Joon Kim's co-authors include Young‐Chang Joo, In‐Suk Choi, Young-Bae Park, Kiwook Lee and Jae-Dong Kim and has published in prestigious journals such as Acta Materialia, Carbon and ACS Applied Materials & Interfaces