Chau‐Jie Zhan

17 papers and 100 indexed citations i.

Chau‐Jie Zhan has authored 17 papers that have received a total of 100 indexed citations. This includes 14 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Chau‐Jie Zhan is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers) and collaborates with scholars based in Taiwan and United States. Chau‐Jie Zhan's co-authors include Chang‐Chun Lee, Yu-Min Lin, Chun-Hao Koo, Tao‐Chih Chang and Tsung‐Fu Yang and has published in prestigious journals such as Materials Science and Engineering A, Vacuum and Microelectronic Engineering