Chengwen He
About
Chengwen He has authored 17 papers that have received a total of 421 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (5 papers). Chengwen He is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (5 papers) and collaborates with scholars based in China, United States and Canada. Chengwen He's co-authors include Yonghuan Guo, Jiguang Han and Jun Cai and has published in prestigious journals such as Materials Science and Engineering A, Sensors and IEEE Access
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Brendan J. Clark are about Top fields papers by Michael A. Kovacs are about Top authors papers by Gary P. Hingorani are co-authored with Top authors papers by Deborah L. Hixon are co-authored with Top authors papers by Irene Levin are co-authored with Top authors papers by Mellita Caragiu are co-authored with Top authors papers by Catherine M. Gliddon are co-authored with Top countries impacted by papers by Carolyn J. Kubik