Che‐Yu Li
About
Che‐Yu Li has authored 99 papers that have received a total of 2.0k indexed citations.
This includes 45 papers in Materials Chemistry, 43 papers in Mechanical Engineering and 33 papers in Electrical and Electronic Engineering. The topics of these papers are Copper Interconnects and Reliability (21 papers), Electronic Packaging and Soldering Technologies (21 papers) and Microstructure and mechanical properties (18 papers). Che‐Yu Li is often cited by papers focused on Copper Interconnects and Reliability (21 papers), Electronic Packaging and Soldering Technologies (21 papers) and Microstructure and mechanical properties (18 papers) and collaborates with scholars based in United States, Australia and Taiwan. Che‐Yu Li's co-authors include M. A. Korhonen, W. R. LaFontaine, Fei Huang, D. D. Brown and G.L. Wire and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemical Engineering Journal
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