Chi-Yang Yu

18 papers and 341 indexed citations i.

Chi-Yang Yu has authored 18 papers that have received a total of 341 indexed citations. This includes 16 papers in Mechanical Engineering, 15 papers in Electrical and Electronic Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (10 papers). Chi-Yang Yu is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (10 papers) and collaborates with scholars based in Taiwan, United States and China. Chi-Yang Yu's co-authors include Jenq‐Gong Duh, Wei-Yu Chen, Wenlin Chen, Kuo-Chuan Liu and Tae-Kyu Lee and has published in prestigious journals such as Journal of The Electrochemical Society, Materials Science and Engineering A and Journal of Materials Science